Wafer pedestal with contact array

ABSTRACT

The invention provides a wafer heating pedestal including a shaft connected to a bottom of a plate. The shaft holds a contact array being in contact with plural contact pads of the plate. The contact array includes plural contact columns.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201910467555.X filed on May 31,2019, the entire contents of which are hereby incorporated by reference.

BACKGROUND Technical Field

The present invention relates to a wafer heating pedestal, particularlya wafer heating pedestal having a contact array and a cooling member.

Description of Related Art

For a conventional semiconductor processing equipment, a wafer heatingpedestal within a reaction chamber is used for supporting a wafer in thechamber to carry out various processes, such as etching. During generalwafer processes, there is a requirement for thermal control. Based onthis purpose, the wafer heating pedestal is designed to provide aheating device for thermal control, which is able to precisely controlwafer temperature in various applications of processes. In general, awafer heating pedestal includes a ceramic or metal plate and a heatingassembly enclosed in the plate, such as a heating coil. Morespecifically, the wafer heating pedestal can further include a thermalsensor, a controller and other electronic components.

Heating is a crucial step among the various wafer processes, such asCVD, PECVD, lithography, etching and cleaning. This is because theoperative temperature plays an important role in chemical reactionprocesses. Reaction gas and substance on the wafer surface form aconductive thin film or an insulating layer through chemical reaction.To obtain a high quality thin film with an even thickness, the thermalcontrol is one of several important facts during the processes.

A known wafer heating pedestal with multiple heating areas includes aplate having multiple resistance heating components, and each of theheating components is controlled by a respective controller such thatthe plate is able to provide distinct heating degrees over the multipleheating areas. By applying proper power to respective heatingcomponents, the temperature over the wafer is maintained, and a betterresult from the reaction can be obtained. In addition, the heatgenerated by the wafer heating pedestal will transfer downward to itsbottom and whereby may interfere a temperature gradient in theprocessing chamber, leading to an undesired result.

Therefore, there remains a need for developing a better wafer heatingpedestal with multiple heating areas while overcoming the issue oftemperature gradient.

SUMMARY OF INVENTION

One objective of the invention is to provide a wafer heating pedestal,including a plate having a carrying surface for supporting a wafer and abottom surface opposite to the carrying surface, wherein the bottomsurface is provided with a plurality of contact pads; and a shaftconnecting to the bottom surface of the plate and holding a contactarray being in contact with the plurality of the contact pads, thecontact array including a plurality of contact columns.

In some embodiments, the plate includes one more heating assemblies andone more sensing units embedded therein, and each of the one or moreheating assemblies defines a heating zone of the plate, each of the oneor more heating assemblies electrically connects to at least threecontact pads.

In some embodiments, the plate has a plurality of vias formed thereinand connecting the heating assemblies and the contact pads.

In some embodiments, the shaft holds a base positioning the plurality ofcontact columns.

In some embodiments, each of the plurality of the contact columnsincludes a pillar and a sheath cladding over the pillar, wherein thepillar is configured to move relatively to the sheath in a reciprocationway, and the sheath is received in the base.

In some embodiments, a top of the pillar has a contact cap while aspring is provided between the contact cap and the sheath.

In some embodiments, the plurality of the contact columns of the contactarray electrically couples to a plurality of metal rods in order todeliver signal associated with said heating assembly and said sensingunit.

In some embodiments, the shaft connects to a cooling member whichextends from an interior of the shaft to an exterior of the shaft.

In some embodiments, the cooling member connects to a bottom of theshaft, the cooling member has an upper part and a lower part wherein theupper part extends into the shaft while the lower part is exposed to theoutside of the shaft and has plural cooling paths.

In some embodiments, the cooling member is configured to contact with aplurality of metal rods to transfer the heat of the plurality of metalrods.

In some embodiments, the contact array has thirty six contact columns.

In some embodiments, a portion of the cooling member is exposed to aninterior of a processing chamber.

Advantages and features of the present invention will be discussed indetails through the following description and drawings illustrated bythe principle of invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-mentioned and other features and advantages of the disclosurecan be better understood with reference to the following detaileddescription and drawings.

FIG. 1 is a perspective view showing a wafer heating pedestal accordingto the present invention.

FIG. 2 is a cross-sectional view of FIG. 1.

FIG. 3 shows an embodiment of a contact array according to the presentinvention.

FIG. 4A shows a contact column of the contact array.

FIG. 4B shows a cross-sectional view of FIG. 4A.

FIG. 5 shows a cross-sectional view of a cooling member according to thepresent invention.

FIG. 6 shows the contact array contacting with the bottom of the plateaccording to the present invention.

FIG. 7 shows a connection between a contact pad and a contact column.

DETAILED DESCRIPTION

Various exemplary embodiments will be described in detail with referenceto the accompanying drawings that form a part of the present disclosure.Also, these embodiments are described with examples that could becarried out to achieve said embodiments, wherein sufficient details areprovided to allow a person ordinarily skilled in the art to achieve saidembodiments. It will be appreciated that, without departing from thespirit and scope of said embodiments, other embodiments could be usedand other changes could be made. In addition, despite the foregoing,appearances of the phrase “in one embodiment” are not necessarilyreferring to the same or one single embodiment. Therefore, the followingdetailed description is not to be taken in a limiting sense, and thescope of said embodiments is defined by the appended claims alone.

Unless otherwise specified in the entire description and the appendedclaims, each of the following terms carries the meaning specificallydefined below. As used herein, unless otherwise specified, the term “or”is to be taken in an inclusive sense, and is equivalent to the term“and/or.” Unless otherwise specified herein, the term “according to” isnot to be taken in an exclusive sense, and allows references to be madeto many other factors not described herein. Additionally, in the entiredescription, the terms “a,” “one” and “the” are also used in the pluralsense. The term “in” is used herein to mean both “in” and “on.”

The present invention provides a wafer heating pedestal adapted forvarious processing chambers implementing heating treatment.Particularly, the wafer heating pedestal according to the presentinvention is a heating pedestal with multiple heating areas such that aheating temperature close to the wafer center and another heatingtemperature close to the wafer edge may be different, which is able toremedy a temperature difference existed between the center and the edgeof the wafer, achieving an effect of even heating.

FIG. 1 illustrates a wafer heating pedestal (100) according to thepresent invention, which has a similar appearance as a known waferpedestal, having a plate (110) and a shaft (120). The plate (110) has acarrying surface (not shown) for carrying a wafer to be processed. Abottom surface (111) is opposite to said carrying surface (110). Theshaft (120) connects to the bottom surface (111) of the plate (110). Theshaft (120) according to the present invention has a cooling member(130) coupled to the bottom thereof for dissipating the extra heataccumulated in the heating pedestal. Details of the cooling member (130)will be described later. In one embodiment, a portion of the coolingmember (130) is configured to expose to a cavity space (not shown) whilethe heating pedestal (100) is installed in the processing chamber (notshown). That is, the cooling member (130) will be partially exposed to avacuum environment during the processing. Moreover, a portion of thecooling member (130) can be mechanically coupled to an external drivingdevice. Alternatively, a portion of the cooling member (130) may beexposed to atmospheric environment outside the chamber.

FIG. 2 illustrates a cross-sectional view of FIG. 1. As shown in thefigure, the shaft (120) is a hollow column and the cooling member (130)has a portion extending into the interior of the shaft (120). Aplurality of metal rods (140) penetrates over the cooling member (130)and extends all the way to the top of the shaft (120) to electricallyconnect to a contact array (shown in FIG. 3). The cooling member (130)is configured to have plural holes (not numbered) for guiding thepenetration of metal rods (140) and determining a layout of the metalrods (140).

The plate (110) has one or more heating components (not shown) embeddedtherein, such as plural independent heating coils. In an application ofmultiple heating areas, the plate (110) may have at least two heatingcoils embedded therein and respectively having different parts of radialcoverage. The plate (110) may further have one or more sensing units(not shown) embedded therein, such as a resistance temperature detector(RTD), used for acquiring temperature data over different positions ofthe plate (110). Said heating component and sensing unit areelectrically coupled to the metal rods (140), via which, to receivepower and provide sensing signal. In an application of plasmaprocessing, the plate (110) may have a metal layer (not shown) embeddedtherein, the metal layer is configured as a bottom electrode which iselectrically coupled to an RF circuit through one of the metal rods(140). These arrangements will be described in FIG. 6.

FIG. 3 simply illustrates a configuration of a contact array (300)according to the present invention, without showing a wall of the shaft(120). The contact array (300) includes a plurality of contact columns(301). The embodiment illustrates thirty six contact columns (301) whileless or more number of that is feasible. These contact columns (301) aresecurely held in a base (302) having plural holes being in a particularlayout and the contact columns (301) are in contactless with each other.The shape of the base (302) fits the shaft (120), which can be, forexample, a round shape. The base (302) may be made of non-conductiveceramic, such as ALN. As shown in figure, the exterior of the base (302)is in contact with the interior of an insulating wall (303) and heldclosed to the top of the shaft (120). The insulating wall (303) is heldin between the base (302) and the wall of the shaft (120) such that thetransverse spread of heat from the metal rod toward the periphery of theshaft (120) can be avoided. The insulating wall (303) is made of quartz.

As illustrated, the base (302) has an unfilled hole (not numbered)defined at its center. In the application of plasma processing, the holemay receive a contact column and a metal rod for electrically couplingthe bottom electrode of the plate (101). The illustrated contact column(301) has a top terminal extending from a top surface of the base (302)and a bottom terminal extending from a bottom surface of the base (302).A top terminal of each of the metal rod (140) electrically contacts withthe bottom terminal of each of the contact columns (301). The topterminals of these metal rods (140) locate at a same height, and thusthe top terminals of the contact columns (301) locate at a same height.The cooling member (130) has a portion extending and adjacent to thebottom of the base (302) but without contacting the base (302). In thisway, the cooling member (130) can have a maximum contact area with themetal rods (140).

FIG. 4A and FIG. 4B simply illustrate a single contact column (301) anda cross-sectional structure thereof. In fact, said contact column (301)is a movable member assembled by multiple components including a pillar(400) and a sheath (401) cladding over the pillar (400). The pillar(400) is a vertical extending structure and has a contact cap (402) onits top terminal with a curved surface for contacting with an exposedcontact pad (shown in FIG. 7) of the bottom (111) of plate (110). Inother possible embodiments, the contact cap (402) may be constructed inother shape or be neglected. The sheath (401) has a hole for receivingthe pillar (400) and permitting the pillar (400) moves in a verticalreciprocation way relatively to the sheath (401). The sheath (401) isconfigured to be received in the corresponding holes of the base (302).For example, the sheath (401) is provided with a particular structure onits surface whereby the sheath (401) can securely be received in thebase (302). A spring (403) is provided between the contact cap (402) ofthe pillar (400) and the sheath (401), the spring (403) supports thepillar (400) at a height. The spring (403) allows a downward movement ofthe pillar (400) when the contact cap (402) is subjected to a pressforce. In other word, the contact array according to the presentinvention provides a flexible contact.

The bottom terminal of the pillar (400) is in electrical contact withthe top terminal of the metal rod (140). A connector (404) is providedat said contact position for electrically connecting or holding thepillar (400) and the metal rod (140). For example, said connector (404)may be a crimp connector. In some embodiments, other types of connectormay be feasible or be neglected. Referring back to FIG. 3, theconnectors are disposed at a space between the base (302) and thecooling member (130) when the contact columns (301) are held by the base(302).

FIG. 5 illustrates a cross-sectional view of the cooling member (130)according to the present invention. The cooling member (130) connects tothe bottom of shaft (120) and extends from the interior of shaft (120)to its exterior. That is, a portion of the cooling member (130) ishidden in the shaft (120) while another portion of the cooling member(130) is exposed to the cavity of the processing chamber. Specifically,the cooling member (130) has an upper part (501) and a lower part (502),wherein the upper part (501) extends inside the shaft (120) and thelower part (502) is exposed to the outside of the shaft (120). Thecooling member (130) has a shoulder (503) for contacting with the bottomof the shaft (120) and whereby defines the upper part (501) extending inthe shaft (120) and the lower part (502) exposed out of the bottom ofthe shaft (120). The cooling member (130) has plural holes for receivingthe metal rods (140) and contacting the surface of metal rods (140) asmuch as possible. As such, the heat accumulated on the metal rods (140)can be transferred from the upper part (501) to the lower part (502) ofthe cooling member (130).

As shown in figure, the lower part (502) further has plural grooves(504) recessed from the surface of cooling member (130), and wherebyincreasing a contact area with the peripheral environment of the coolingmember (130). In one embodiment, a collar (505) is provided on theexterior of the cooling member (130) and communicating with the grooves(504) in order to form a cooling channel with water flow, enhancing theperformance of the cooling member (130). That is, the cooling member(130) according to the present invention may be further coupled to awater supplying device.

In one embodiment, although not shown in the drawing, the lower part(502) of the cooling member (130) has a portion exposed to the cavity ofthe processing chamber while a another portion of the lower part (502)connecting to a driving device or exposed to the atmospheric environmentoutside the processing chamber. In one embodiment, the interior space ofthe shaft (120) is a vacuum environment and does not communicate withcavity of the processing chamber.

FIG. 6 schematically shows a cross sectional view of the partial plate(110). The contact columns (301) of the contact array is biased by thesprings to contact with the bottom surface (111) of the plate (110). Theplate (110) has plural heating assemblies embedded therein, such asheating coils. The drawing only illustrates one heating assembly (601)located about the center of the plate (110) while another heatingassembly may be located about the edge of the plate (110). The heatingassembly (601) electrically couples to some of the contact columns (301)through plural vias (602). For example, four contact columns is shown inthe embodiment. The via (602) may include a vertical via and a lateralvia. However, only a vertical is presented herein. In addition, two ofthese vias (602) may be electrically connected by a lateral vias (notshown) such that two of these contact columns (301) may be able toelectrically connect to another heating assembly (not shown).

A metal rod (603) is arranged at the center of the contact array, andthe metal rod (603) is inserted into the plate (110) and extends to abottom electrode (604). The metal rod (603) may be made of nickel. Thetop of the metal rod (604) electrically connects to the bottom electrodethrough a welding joint (605). Similar to PCB manufacturing, the plate(110) and electronic components thereof may be manufactured bymulti-layered stacked ceramic sheets.

FIG. 7 schematically illustrates a stacked structure of the plate (110).The bottom of each of the vias (602) connects to a contact pad (606).The contact pad (606) is configured to expose, with its bottom surface,at and coplanar with the bottom surface (111) of the plate (110).Preferably, the area of the contact pad (606) is larger than a width ofthe contact column (301) to ensure fully contact. In some embodiments,the contact pad (606) may be configured to slightly protruding from thebottom surface (111) or slightly retracted from the bottom surface(111). In possible embodiments, the contact pad (606) may be removed orbe part of each via (602). The number and positions of the contact pads(606) are determined by the layout of the contact array. For example,there could be at least three contact pads (606) connect to the same oneheating assembly, but no more than five.

Above all, the present provides a particular contact array for a waferheating pedestal, such contact array permits a better connection betweenthe metal rods and the electronic components to complete tasks of powersupplying and receiving sensing signal. In addition, the presentinvention provides a cooling member which enhances the cooling abilityto whereby facilitate manufacturing applications requiring heatingtreatments.

The above-mentioned details provide a thorough description regarding themanufacture and use of combinations of said embodiments. Variousembodiments can be made without departing from the spirit and scope ofsuch description. Thus, these embodiments will be included in theappended claims.

What is claimed is:
 1. A wafer heating pedestal, comprising: a platehaving a carrying surface for supporting a wafer and a bottom surfaceopposite to the carrying surface, wherein the bottom surface is providedwith a plurality of contact pads; and a shaft connecting to the bottomsurface of the plate and holding a contact array being in contact withthe plurality of the contact pads, the contact array including aplurality of contact columns.
 2. The wafer heating pedestal as claimedin claim 1, wherein the plate includes one more heating assemblies andone more sensing units embedded therein, and each of the one or moreheating assemblies defines a heating zone of the plate, each of the oneor more heating assemblies electrically connects to at least threecontact pads.
 3. The wafer heating pedestal as claimed in claim 2,wherein the plate has a plurality of vias formed therein and connectingthe heating assemblies and the contact pads.
 4. The wafer heatingpedestal as claimed in claim 1, wherein the shaft holds a basepositioning the plurality of contact columns.
 5. The wafer heatingpedestal as claimed in claim 4, wherein each of the plurality of thecontact columns includes a pillar and a sheath cladding over the pillar,wherein the pillar is configured to move relatively to the sheath in areciprocation way, and the sheath is received in the base.
 6. The waferheating pedestal as claimed in claim 5, wherein a top of the pillar hasa contact cap while a spring is provided between the contact cap and thesheath.
 7. The wafer heating pedestal as claimed in claim 2, wherein theplurality of the contact columns of the contact array electricallycouples to a plurality of metal rods in order to deliver signalassociated with said heating assembly and said sensing unit.
 8. Thewafer heating pedestal as claimed in claim 1, wherein the shaft connectsto a cooling member which extends from an interior of the shaft to anexterior of the shaft.
 9. The wafer heating pedestal as claimed in claim8, wherein the cooling member connects to a bottom of the shaft, thecooling member has an upper part and a lower part wherein the upper partextends into the shaft while the lower part is exposed to the outside ofthe shaft and has plural cooling paths.
 10. The wafer heating pedestalas claimed in claim 8, wherein the cooling member is configured tocontact with a plurality of metal rods to transfer the heat of theplurality of metal rods.
 11. The wafer heating pedestal as claimed inclaim 1, wherein the contact array has thirty six contact columns.
 12. Aprocessing chamber, comprising the wafer heating pedestal as claimed inclaim 8, wherein a portion of the cooling member is exposed to aninterior of the processing chamber.